HP leads digital revolution in packaging

April 11, 2018

With the addition of the HP PageWide C500, HP has the most comprehensive digital printing portfolio for corrugated with both preprint and postprint.

Other presses in the lineup include preprint machines, T1100S and T400S. The first T400S in Asia Pacific was recently installed at Sejoong Industries in South Korea.

 

Completing the corrugated portfolio, are the HP Scitex 17000 Corrugated Press and the HP Scitex 15500 Corrugated Press.

 

Along with the C500 press showcase, HP made several essential labels and packaging announcements.

 

First of which is the launch of the new HP Indigo 6900 digital label press. It features Pack Ready for Labels, a new HP Indigo ElectroInk Silver, and a new high-performance Digital Front End.

The press also features an integration with the HP Indigo GEM embellishment unit, the first fully digital, one-pass label printing and embellishment solution for spot, tactile, foil, holograms, mini textures and lamination.

 

The HP Indigo Pack Ready Laminator is now commercially available for the HP Indigo 20000 flexible packaging press. It is a pioneering technology that allows for immediate time-to-market of HP Indigo digitally printed flexible packaging by eliminating the use of adhesives.

With the announcements, HP Inc. expanded its total label and packaging portfolio. The expansion follows the largest packaging deal ever for HP Indigo with ePac, a US all-digital flexible packaging converter. The company purchased 10 HP Indigo 20000 digital presses for its facilities throughout the US.

 

“Our customers are growing fast across all segments and are experiencing massive success. They are leveraging HP technology to innovate and deliver on brands’ evolving needs,” said Santi Morera, global head of graphics solutions business, HP Inc.

 

“These new technologies we are launching are needed now more than ever and will allow our customers to be more productive.”

This article was first published in the March 2018 issue of Labels and Packaging Innovation Asia.

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