• Print Innovation Asia

Highcon and EFI announce global partnership


Highcon Systems Ltd and EFI announced that the two companies have entered into a global partnership agreement. With a common group of core customers, the goal is to offer customers an integrated, end-to-end business productivity and workflow solution, providing a flexible foundation for digital growth.


The industry leading EFI Packaging and Corrugated Suites deliver off the shelf productivity benefits that target specific business areas to reduce waste and inefficiency in the packaging production process, driving cost savings with integrated eCommerce, ERP and shop floor data collection.

In the coming Highcon Euclid and Beam software release, customers will be able to integrate with the EFI MarketDirect PackCentral online customer ordering portal and EFI Auto-Count 4D software, which automatically collects accurate, up-to-the-minute production data for digital presses and cutting devices.

This partnership is expected to significantly improve lead times for printed material development by delivering a fully optimized supply chain that brings together buyers, converters, and digital converting equipment through robust two-way connectivity.


This comprehensive platform delivers real value to businesses looking to improve efficiency, manage and optimize paper and inventory, reduce process waste and improve profits by leveraging automation.

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